HY 204 THERMAL PUTTY Thermal Putty Heat Sink Putty is a reliable heat-conductive solution designed to improve cooling efficiency across a wide range of electronic devices. With its low thermal resistance and high thermal conductivity, this thermal putty ensures stable heat transfer between chips, heatsinks, and other components—making it an excellent choice for GPUs, RAM modules, mining rigs, smartphones, and other high-performance electronics.
Its flexible formulation allows for easy application and filling of micro gaps, ensuring maximum surface contact and effective thermal management. Ideal for both professional technicians and DIY users, the HY 204 delivers long-lasting durability and consistent performance under demanding conditions.
Key Features
High Thermal Conductivity – Efficiently transfers heat for optimal cooling.
Low Thermal Resistance – Enhances contact between surfaces, reducing overheating.
Wide Compatibility – Suitable for GPU, RAM, mining machines, smartphones, and more.
Easy to Apply – Flexible consistency for precise placement and gap filling.
Durable Performance – Stable operation for long-term use under high loads.
Package Includes
1 × HY 204 Thermal Putty