Relife HW21S 183°C Solder Paste Low-Temperature Precision Soldering is a high-performance soldering material developed for SMT, BGA, IC chips, LED patches, and motherboard repair. With a low melting point of 183°C, it is ideal for temperature-sensitive components, ensuring safe and reliable soldering without damaging delicate circuits.
Designed for professional technicians, the HW21S delivers smooth flow, strong solder joints, and excellent electrical conductivity with minimal residue.
Key Features
Low Melting Point (183°C): Optimized for medium-temperature soldering, protecting heat-sensitive components while maintaining strong joint quality.
Excellent Conductivity & Strength: Enhanced with lead and silver elements to improve electrical conductivity and mechanical strength of solder joints.
Smooth, Consistent Flow: Moderate humidity and fine paste structure prevent agglomeration, making it easy to apply and tin without false soldering.
Clean & Reliable Soldering: Produces bright solder joints with minimal residue, strong creep performance, oxidation resistance, and no corrosion to PCBs. No cleaning required after soldering.
Professional-Grade Performance: Ensures stable and consistent results for precision soldering in complex electronic circuits.
Specifications
Brand: Relife
Model: HW21S
Type: Low-temperature solder paste
Melelting Point: 183°C
Applications: SMT, BGA, IC chips, LED patches, PCB and motherboard repair
Properties: High conductivity, strong bonding, low residue, oxidation resistance
Packing Include:
1 x Relife HW21S 183°C Solder Paste Low-Temperature Precision Soldering