100g AMTECH RMA-559 Solder Flux Solder Paste for BGA specifically engineered for BGA, CSP, and PGA rework. Its advanced no-clean formula provides excellent solder-stickiness, minimal residue, and superior wetting performance – perfect for precision electronics repair and assembly.
Key Features:
Superior Solder-Stickiness: Ensures strong and reliable solder joints for critical components.
Anti-Wet Technology: Prevents unwanted solder bridging, improving accuracy in BGA rework and PCB assembly.
No-Clean Formula: Leaves minimal, light-colored residue – no need for post-cleaning.
Lead-Free & Eco-Friendly: Complies with modern RoHS and environmental standards.
Low-Smoke & Odorless: Provides a cleaner, safer soldering experience.
Wide Compatibility: Ideal for BGA reballing, CSP packages, north/south bridge repairs, video chips, mobile chips, and PCB reflow work.
Specifications:
Product Name: AMTECH RMA-559 Flux Paste
Flux Type: NC-559-ASM TPF (No-Clean)
Weight: 100g
Form: High-viscosity cream paste
Application: Suitable for BGA, PGA, CSP, Flip-Chip operations, and reflow soldering
Residue: Low, light-colored, non-corrosive
Smoke & Odor: Minimal for a safer workspace
Packing Include:
1 × 100g AMTECH RMA-559 Solder Flux Paste